PEOPLE

DIRECTOR

JOHN LAMBROS

Willett Professor of Engineering

(217) 333-2242

310 Talbot Laboratory

About

EDUCATION

1994 Ph.D.  Aeronautics, California Institute of T echnology Thesis : Dynamic decohesion of bimaterial interfaces Minor Subject : Materials Science

1989 M.S. – Aeronautics, California Institute of Technology

1988 B.Eng. – Aeronautical Engineering, Imperial College of Science and Technology, London Degree awarded with First Class, Honors. Thesis: Measurement of the strength of adhesive bonded joints and the shear lag method for predicting strength.

POSITIONS HELD

2018– Donald Biggar Willett Professor. College of Engineering. University of Illinois at Urbana-Champaign

2018– Director of AMTEL. Advanced Materials Testing and Evaluation Lab College of Engineering. University of Illinois at Urbana-Champaign. 

2014 Visiting Professor. Mechanical Engineering. University of Liverpool, U.K.

2011–2016 Associate Head for Graduate Studies. Aerospace Engineering. University of Illinois at Urbana-Champaign.

2007– Professor. Aerospace Engineering. University of Illinois at Urbana-Champaign

2006– Affiliate Professor. Computational Science and Engineering. University of Illinois at Urbana-Champaign

2002– Affiliate Professor. Mechanical Science and Engineering. University of Illinois at Urbana-Champaign.

2000–2007 Associate Professor. Aerospace Engineering. University of Illinois at Urbana-Champaign

1995–2000 Assistant Professor. Mechanical Engineering. University of Delaware.

1994–1995 Research Fellow. Aeronautics. California Institute of Technology

RESEARCH INTERESTS

Multi- length and time scale experimentation; Dynamic crack initiation, growth and arrest in multiphase systems; Dynamic fracture, failure, and wave propagation in composite materials; Stress wave mitigation through microstructural tailoring and material design; Dynamic constitutive response of traditional and advanced materials; Thermomechanical effects and adiabatic shear banding; High temperature thermomechanical fatigue of metals; Failure and reliability of microelectronics, thin films and nanolayered materials; 3D X-ray tomography and Digital Volume Correlation; Failure mechanisms of Li+ battery electrodes.